BEGIN:VCALENDAR
VERSION:2.0
METHOD:PUBLISH
CALSCALE:GREGORIAN
PRODID:-//WordPress - MECv7.5.0//EN
X-ORIGINAL-URL:https://tlmi.com/
X-WR-CALNAME:TLMI
X-WR-CALDESC:
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-PUBLISHED-TTL:PT1H
X-MS-OLK-FORCEINSPECTOROPEN:TRUE
BEGIN:VEVENT
CLASS:PUBLIC
UID:MEC-3b5020bb891119b9f5130f1fea9bd773@tlmi.com
DTSTART:20260611T040000Z
DTEND:20260613T040000Z
DTSTAMP:20251211T204200Z
CREATED:20251211
LAST-MODIFIED:20251211
PRIORITY:5
SEQUENCE:2
TRANSP:OPAQUE
SUMMARY:AIPIA & AWA Smart Packaging World Congress 2026
DESCRIPTION:\nWhy attend?\n\n\n\nAIPIA & AWA Smart Packaging World Congress 2026\nSmart. Connected. Data-Driven: The New Era of Packaging\nJoin global leaders in Amsterdam for the Smart Packaging World Congress 2026, co-hosted by AIPIA (Active & Intelligent Packaging Industry Association) and AWA (Alexander Watson Associates). This year’s event explores how smart, connected, and data-driven packaging is transforming industries—from FMCG and pharma to logistics and retail.\nAs packaging evolves into a powerful tool for digital engagement, traceability, and sustainability, the Congress provides a high-impact platform for innovation, strategy, and collaboration across the full value chain.\nWhat to Expect:\n\nVisionary keynotes and real-world case studies\nInteractive panels featuring tech innovators and brand leaders\nInsights on the business impact of intelligent, connected packaging\n\n\nSmart. Connected. Data-Driven.\nDon’t miss your opportunity to shape the next era of packaging innovation.\nSee you in Amsterdam!\n\n\n
URL:https://tlmi.com/events/aipia-awa-smart-packaging-world-congress-2026/
ATTACH;FMTTYPE=image/png:https://tlmi.com/wp-content/uploads/2025/12/AIPIA-2026-main-banner48.png
END:VEVENT
END:VCALENDAR
